我拥有的EMC,EMI,可靠度方面的资料

我拥有的EMC,EMI,可靠度方面的资料我将陆续上传.
联系方式:QQ:16322127(可通过QQ索取,要标注EMC,EMI,可靠度字样)

电磁兼容原理与设计(基础知识)
Digital Signal Integrity-Modeling and Simulation with Interconnects and Package
EMC basic
EMC的民用
EMC技术介绍
EMC技术介绍
EMC设计技术
EMI 濾波器設計方法
ESD问答
High-speed Digital Design - Johnson & Graham
High-Speed Digital System Design
PCB上信号线产生的电磁频谱
板级EMC设计
避免混合讯号系统的设计陷阱
标准化与认证
单片机系统常用软件抗干扰措施
地线干扰与抑制
电磁干扰滤波电容器使用方法
电磁兼容标准汇编(基础、通用类卷)
电磁兼容测试
电磁兼容技术
电磁兼容设计工程手册
电气设备内部干扰的抑制
高频干扰的防治
基本名词术语
基础
计算机电磁兼容
开关电源的电磁兼容设计
开关电源的尖峰干扰及其抑制
开关电源的抗干扰问题
让我们一起认识手机辐射
输入滤波器的设计

雷击浪涌发生器操作手册
EMC的基础与实践
EMC实验设备
电磁兼容标准汇编(电工、电子类卷)
电磁兼容技术及电磁兼容实验室介绍
电磁兼容试验的注意事项:
电磁兼容试验室建造方案
电磁兼容试验室平面布置示意图-1
PCB Designer's SI Guide
BGA检测技术与质量控制
BGA器件及其焊点的质量控制
Layout_glossary
PCB化学镀铜工艺流程解读(二)
PCB化学镀铜工艺流程解读(一)
PCB基板材料选择
PCB通孔电镀技术
SMT工作流程圖
smt过程缺陷样观和对策
SMT十步驟(電子檔)
波峰焊
内埋电阻
去藕电容在PCB板设计中的应用
特性阻抗之诠释与测试
特性阻抗資訊
無鉛銲錫物料與組裝之研究
印刷电路板排版设计
Abatement of Static Electricity
An EMC Directive for the Next Century
Australian EMC Regulation and Routes to Compliance
Building a Bridge Between Product Safety and EMC
Commercial Practices Standard Set to Replace MIL-STD 1686
Developments in Electrical Safety Testing
Electrical Safety Testing
Electromagnetic Compatibility
EMC & EMI of computer
emc amplifiers
EMC annata select
emc antennas
emc chamber note
EMC design
EMC Shielding
emc test of household
EMI Gasket
EMI Shielding Gasket
emidamage
grounding
Minimizing EMI from Heat Sinks
Mitigating EMI in High-Speed Digital Transmission Networks
PCB design & EMI
Performing Safety
Product Safety Standards
Product Safety
Terminology for electromagnetic compatibility
USB Interfaces and EMC
What to Look for in an EMC Antenna
EMC Problems with Mobile Radio
EMC test and design
EMI detect
EMI fillite
EMI Requirements in Japan
EMI solution
Evaluating the Nonmagnetic Shields
computer ESD solution
From Electrostatics to ESD
What It Means to ESD
Electronic Design
Electronic System Design
EMC Technology
High SpeedBoard Design

CD1'目录

//softwarefmea
//using_failure_mode_and_effects_analysis_in_healthcare
//software reliability
//Reliability Prediction of Substitute Parts Based on Component
Temperature Rating and Limited Accelerated Test Data
//Reliability Review of North American Gas/Electric System
Interdependency
//Semiconductor Device Reliability Failure Models
//accelerated testing
//Avoiding Vibration in Odd-Shaped
Printed-Circuit Boards
//Better Accelerated Tests
//HALT AND HASS ON THE VOICEMEMO
//Combining Moments of Inertia
//Confidence_interval_of_proportions
//Functional Requirements
//Designing Electronics for High Vibration and Shock
//SUMMARY OF HALT AND HASS RESULTS AT AN ACCELERATED RELIABILITY TEST CENTER
//Highly Accelerated Stressing of Products With Very Low Failure Rates
//HASS DEVELOPMENT METHODOLOGY HOW TO DEVELOP A SCREEN,WHEN TO CHANGE A SCREEN, AND WHEN TO RE-PROVE A SCREEN
//honeywell reliability
//How to Justify Machinery Improvements
//IBM consulting-Becoming A Process Based Organization
//IBM演示技巧教程
//MTBF Report_13 October 04
//MTBF_Paper
//ACCELERATED RELIABILITY TEST TECHNIQUES USED TO FIND DEFECTS WITHIN PRINTED CIRCUIT BOARDS
//Potential Failure Mode and Effects Analysis
//WHY HALT CANNOT PRODUCE A MEANINGFUL MTBF NUMBER AND WHY THIS SHOULD NOT BE A CONCERN
//How to Use Visual Effects to Support Your PresentationA PowerPoint Training
//precautionsic for Use of High-Voltage Monolithic ICs
//PRE-HALT ANALYSIS IS ESSENTIAL FOR A SUCCESSFUL HALT
//Preventing Vibration Damage in Electronic Assemblies
//Reliability and Availability
//An Extended Reliability Growth Model For Managing And Assessing Corrective Actions
//Reliability Monitor Report
//reliability tools and integration in the manufacting phase
//SEMICONDUCTOR DEVICE RELIABILITY
//An introdution to Reliability_and_availability
//Reliability_Mathematics
//reliability-pricing-model-overview
//rr_ed_fault_risk_reduction
//software_reliability_measurement or Life Cycle Core Knowledge Requirements for Software Reliability Measurement
//Taking Shake Out of Circuit Boards
//THERMAL AND VIBRATION ISOLATION TECHNIQUES FOR HARD DRIVES AND PCI CARDS
//Reliability, Availability, and Operability
//PROBABILISTIC ENGINEERING DESIGN
//Where Is My Data For Making Reliability Improvements
//可靠性技术的应用与发展
//蒙特卡罗法在零件可靠性设计中的应用
//Failure Mode and Effects Analysis (FMEA) A Guide for Continuous Improvement for the Semiconductor Equipment Industry
//Automatic FMEA
//Representation of Functional Relations among Parts and Its Application to Product Failure Reasoning
//Design FMEA
//FAILURE MODE AND EFFECTS ANALYSIS (FMEA)
//FPU Failure Mode Effects and Criticallity Analysis
//FAILURE MODE AND EFFECTS ANALYSIS IN MANUFACTURING AND ASSEMBLY PROCESSES
//FAILURE MODE IDENTIFICATION THROUGH CLUSTERING ANALYSIS
//fmea di prodotto
//FMEA TOOLS2
//FMEA opdracht tuinsproeier
//FMEA_Form
//Failure Mode and Effect Analysis (FMEA) Packet
//FLIGHT ASSURANCE PROCEDURE
//fmea_presentation
//Complying with the FMEA Requirements of the New
Patient Safety Standards
//ANALISI DEI MODI E DEGLI EFFETTI DELLE AVARIE
//Risk –Informed Regulation of Marine Systems Using FMEA
//Failure Mode and Effects Analysis
//FAILURE MODES AND EFFECTS ANALYSIS (FMEA) WORKSHEET.
//TOOLS OF RELIABILITY ANALYSIS -- Introduction and FMEAs
//nasa fmea bibliography
//Philips FMEA English
//An Introduction to Risk/Hazard Analysis for Medical Devices
//Using Failure Mode Effect Analysis (FMEA) to Improve Service Quality Service Operations Management
//QUANTIFIED RISK ASSESSMENT TECHNIQUES (PART 1)
//SURFACE VEHICLE RECOMMENDED PRACTICE
//Scenario-based FMEA
//PROCESS HAZARD ANALYSIS
//software fmea
//FMEA(umich)
//FMEA(sverdrup)
//using_failure_mode_and_effects_analysis_in_healthcare
//Procedures for Assessing Risks
//Incorporating a user-focused failure modes
//DACTRON控制器簡介
//包裝落下試驗機簡介
//衝擊試驗機簡介
//電磁式高頻振動試驗機
//環境應力篩選隨機振動簡介
//實驗室英文簡報資料
//實驗室中文簡報資料
//運輸型低頻振動試驗機
//運輸型低頻振動試驗機
//Ntuw_C防爆加热干燥烘箱
//Hot Air Steriliser_C热空气消毒烘箱
//TU 60_C干燥加热烘箱
//Vht_C真空干燥箱
//VTF_C洁净加热干燥烘箱
//Vtl_C加热干燥烘箱
//英国华莱氏公司产品浏览
//BioLine V3.0_C_2003植物生长试验箱
//Company Presentation V3.0_C_2003德国富奇介绍
//Human Performance Testing V3.0_C_2003人体资源测试
//IEC60068-3-5温度变化率
//IP-Overview_C工业防护
//Pharma V3.0_C_2003制药工业的药品稳定性试验
//SC_C_2003阳光模拟试验箱
//Thermalshock_C_2003温度冲击试验箱
//V . T S C H - Climatic Test Cabinet 德国富奇公司-气候试验箱VC4018C
//VP_C_2003药物稳定性试验
//Vsc_C_2003盐雾试验
//Vtsvcs_C_2003快速温度变化试验箱
//Vtvc_detail_C_2003高低温试验箱
//Vtvvcv_C_2003振动和更多的……
//WALK_IN_APP步入式试验室
//Walkin_C_2003步入式模拟环境试验室

CD2目录
  RELIABILITY
//Application Notes for Solid Tantalum Capacitors
//Capacitor Lifetime Calculation 200302
//LIFETME CALCULATION FORMULA OF ALUMINUM ELECTROLYTIC CAPACITORS
//Guide to Use Aluminum Electrolytic Capacitors
//Aluminium Electrolytic Capacitors
//ELECTRICAL CHARACTERISTICS AND EXPLANATION OF TERMS
//电解电容的应用
//电容寿命计算方法:
//電容衝擊試驗報告
//電容衝擊試驗報告
//壽命計算公式-max
//A11空调系统失效模式分析
//FMEA(sumida)
//FMEA
//FMEA手册
//PFMEA案例
//系统FMEA
//Accelerated Thermal Cycling and Failure Mechanisms
//Accelerated_Standards_Transition_Plan_Approved_by_Board_06_04
//Accelerated stress testing
//the enviromental stress screen handbook
//Pre halt analysis
//谈加速寿命试验
//2003 CARTS Derating differences Ta-KO-AO
//sony ss-00259 handbook
//ADI Reliability Handbook
//stress test qualification for discrete semiconductors
//An Overview of Weibull Analysis
//balloons reliability analysis
//An Improved SPICE Capacitor Model
//CONSEQUENCES AND CATEGORIES OF SRAM FPGA
//COST ANALYSIS
//EEE PARTS DERATING
//Stochastic Aging and Dependence for Reliability
//Fault tree construction
//final drive and axle fluid requirements
//Fish Embryo Analysis
//FLOTHERM V4.1 Introductory
//Generalized Step Stress Accelerated Life Model
//HALT & HASS
//IBM ASIC Products Application Note
//IEC 60950
//Improving the Performance of Your Root Cause Analysis (RCA) Program
//The Application of Accelerated Testing Methods and Theory Accelerated Testing Methods and Theory HALT-HASS
//Life Testing and Reliability Predictions for Electromechanical Relays
//MAXIM reliability  report
//TESTING FOR RELIABILITY IN SPACE SYSTEMS
//MTBF Instruction Guide
//MTBF 計算方法概論
//MODELING AND SIMULATION OF RELIABILITY & MAINTAINABILITY PARAMETERS FOR REUSABLE LAUNCH VEHICLES USING DESIGN OF EXPERIMENTS
//on precendence life testing
//MEASUREMENT PRACTICES FOR RELIABILITY AND POWER QUALITY
//POST PROGRAMMING BURN IN (PPBI) FOR RT54SX-S AND A54SX-A ACTEL FPGAS
//Profile_PAL_draft_v1_3b
//MINI DIN Series Connector
Product Specification
(For Internal Use)

// USB Series Connector
  Product Specification
   (For Internal Use)
//THE RETAIL ELECTRIC COMPETITION TASK FORCE
//Reliability as a Systems Engineering Investment Not Just a Cost
//Reliability Design Technology for Power Semiconductor Modules
//Reliability Programs
//Reliability Engineering Principles
//Reliability Testing and Data Analysis of High-Density Packages’Lead-Free Solder Joints
//Dynamic reliability and risk assessment of the accident localization system of the Ignalina NPP RBMK-1500 reactor
//Semiconductor Device Reliability Failure Models
//Software Reliability Handbook Chaper11
//SONY SS-00259-1第四版(英日)
//SONY00254-5-R4
//Standard Linear IC reliability
//Stress test Qualification for Integrated Circuits
//System Availability Modelling
//The Challenge of Supporting Aging Naval Weapon Systems Aging Naval Weapon Systems
//Using Telcordia Calculation Methods to Adjust Failure Rates
//Warranty Cost An Introduction
//wetting balance theory
//包装试验方法
//产品的热设计方法无图
//电子产品可靠性设计及预计
//环境应力筛选(ESS)
//基于模糊优化的零部件疲劳寿命可靠性分析
//结构可靠性分析的区间方法
//可靠性基本计算
//可靠性预计方法及一点思考
//可信性工程
//零库存系统
//潜在失效模式和效果分析
//潜在失效模式和效果分析2
//浅析2×xkW汽车电站双机组对可靠性的影响
//塑膠產品外觀印刷品質檢驗標準
//维护和可靠性
//系统可靠性理论与工程实践
//以可靠性为中心的维护保养
//主板可靠性测试标准流程
//半导体集成电路的可靠性设计
//产品全寿命周期管理中的加速环境试验技术
//当代质量观与可靠性
//电子元器件的可靠性安装
//电子元器件的运输、储存和测量
//电子元器件的质量与可靠性军用标准体系
//电子专用设备的可靠性试验
//电阻器与电位器的可靠性
//二十世纪留给二十一世纪可靠性工程热点问题
//防止可靠性设计分析中的若干片面性
//非工作期微电路的可靠性及其预计
//高加速寿命试验(HALT)与高加速应力筛选(HASS)
//功率模块可靠性
//国外可靠性工程发展
//国外直升机可靠性 维修性和保障性发展综述
//合理选择继电器提高家电可靠性
//基于环境的大型结构物模态试验
//几种电子元器件长期储存的失效模式和失效机理
//可靠度保證-工程與管理技術之應用
//可靠性工作主要内容
//可靠性管理
//可靠性试验的编码故障树分析
//可靠性预计和分配的作用原理及预期效益
//可靠性预计模型的参数敏感度分析
//可靠性增长试验的体会
//美国可靠性分析中心(RAC)的可靠性培训课程
//美国可靠性强化试验技术发展点评
//某平显可靠性鉴定试验及思考
//失效率
//失效率曲线的分析与新修正模型的建立
//寿命数据分析理论参考英文版
//台式电脑电子系统的驱动器可靠性评估
//微电路的质量、可靠性等级
//微电路降额设计指南
//未来电子系统封装可靠性面临的困难
//一种威布尔寿命分布模型
//一种威布尔寿命分布模型
//元件可靠性




   EMC
//EMC电磁屏蔽材料设计者指南
//EMC文章集合(共50篇)
//如何尽量降低PCB板上的地噪声
//防雷器在电源系统中的应用
//  运算放大器的选择方法
//新一代数字IC
//电子设备、分系统和系统的电磁兼容
设计中的可靠性考虑
//射频屏蔽室屏蔽效能的测试技术
//磁屏蔽理论和实践
//局域网的电磁能量泄漏
//开关电源EMI滤波器的正确选择与使用
//如何选择屏蔽外壳
//ESD
//Electronic Design
//Electronic System Design
//EMC design technology
//High-Speed Board Design Techniques
//集肤效应
//Bus LVDS SER/DES FAQs
//ACPI Component Architecture Programmer Reference
//A critique of the EMC Directive
//Abatement of Static Electricity
//An EMC Directive for the Next Century
//COMPLIANCE SYSTEMS CORPORATION app_note_EN61000-4-5
//Australian EMC Regulation and Routes to Compliance
//Building a Bridge Between Product Safety and EMC
//Commercial Practices Standard Set to Replace MIL-STD 1686
//Developments in Electrical Safety Testing
//Electrical Safety Testing
//Electromagnetic Compatibility
//EMC & EMI of computer
//What to look for in an emc amplifiers
//EMC annata select
//What to look for in an emc antennas
//EMC base 基本概念
//EMC Chamber Calibration
//EMC Problems with Mobile Radio
//EMC Shielding
//信息技术设备的电磁兼容性标准
//EMC Standards and Their Application
//EMC standards of all
//EMC Standards
//EMC test and design The Impact of Emerging European Standards 、
//Trends in EMC Testing of household appliance
//智能型框架式断路器单片机系统的电磁兼容性分析
//滤波器在抗EMI中的应用及发展
//Selecting the Right Fabric-Over-Foam EMI Gasket
//EMI Requirements in Japan
//Electromagnetic Interference (EMI) Damage to Giant Magnetoresistive (GMR) Recording Heads
//Evaluating the Nonmagnetic Shields
//Explosion Protection—The New Approach in Europe
//地线干扰与抑制
//超大规模集成电路中的可靠性技术应用与发展
//Medical EMC Standards
//Minimizing EMI from Heat Sinks
//Mitigating EMI in High-Speed Digital Transmission Networks
//Performing Safety Tests to Comply with the Low Voltage Directive
//Product Safety Standards
//Product Safety: Requirements and Methods
//Terminology for electromagnetic compatibility
//The FCC in Action to Address New EMC Concerns


    BATTERY
//Advanced Battery Engineering Facility
//An Analysis and Performance Evaluation of a Passive Filter Design Technique for Charge Pump PLL’s AN-1001
//Introduction to Power Supplies
//Don''t Throw Away Those Batteries!
//battery charging
//Keep Batteriies Alliive Through Better Battery Chargiing
//Demonstrates ACT battery chargers with enrev technology because “Help Can’t Wait”
//Cycling Information
//Efficiency and Power Utilization Data Guide DC DC Conversion Choices in Battery Operated Devices
//DC/DC变换器中的噪声管理
//DESIGN & SAFETY CONSIDERATIONS
//down the idle power DS92LV16 Design Guide
//National Semiconductor DS92LV16 Design Guide
//A USER GUIDE TO COMPENSATING LOW-DROPOUT REGULATORS
//SWITCHING REGULATORS
//Buck-converter Charger also Provides System Power
//Frequently Asked Questions About Regulators
//Batteries The Achilles Heel in Wireless Communications
//Radio Reliability Depends on Careful Planning and Better Battery Charging
//锂离子电池知识汇萃
//如何选择锂离子充电管理IC
//功率因数校正在走向低端电源
//LVDS FAQs Page
//A Guiide to Battery Maiintenance
//Consider the Complete Battery Management Process
//Nickel-Metal Hydride Application Manual
//Public Safety Stays Charged with Battery Equipment
//SYS Dept/BIOS Training_1025
//Power Management - Battery Monitoring
//Power Management - Battery Power Supply
//Power Management for Network Devices
//Emergency Preparedness Gets ACTivated
//Product Family Introduction Page
//A Priimer on Battery Chargiing
//CHARACTERISTICS OF RECHARGEABLE BATTERIES
//RZA Technology
//Smart Battery Data Accuracy Testing Guidelines
//Lower Operating Voltages Force Higher Efficiency Conversion in Battery Operated Appliances
//Targeting the Audiences for New PC Designs
//Temperature Effects
//The Many Flavors of LVDS
//thermal sensor of PC
//Ventation

   BIOS
//BIOS development
//bios function
//bios ring
//bios setup


CD3
Enviroment
//How reverb chambers work
//Chamber Temperature Uncertainty Analysis of the Thunder Scientific Model 2500 Two-Pressure Humidity Generator
//Uncertainty_Analysis Thunder Scientific
//SERIES 2500 BENCHTOP TWO-PRESSURE HUMIDITY GENERATOR
//About Temperature
//Chamber Study
//Circut enviroment test
//Customers Seeking Environmental Testing
//Enviroment test condition
//environmental
//HASS, HALT and ESS for electronics production
//humidity  temperature
//TEMPERATURE & HUMIDITY
AND
FAILURE ANALYSIS
BY
RE ENVIRONMENT TEAM

//Relative Humidity....Relative to What?
//Introduction of temperature measure
//Introduction of Thermal
GGT/RE – Environment Test Team
//USING THERMAL SHOCK
//非密封性分系统热循环试验中的防结露问题
//环境应力筛选有关问题的探讨
//加速试验
//热力学
//温度试验中断处理的依据


  ESS
//2002年度《RAMS》论文目录
//国外CALS近期发展动态综述
//国外CALS近期发展的三个新特点
//CSP封装产品在热应力循环条件下的可靠性分析
//环境应力筛选(ESS)
//ESS
//ESS_Fixture
//《通信设备可靠性通用试验方法》YD/T 282-2000行业标准介绍
//GJB150_19
//HALT& HASS
//国际电工委员会IEC/TC56(可信性技术委员会)颁发的“可信性”国际标准
//Improper_ESS
//Improper_ESS_part_2
//MANAGING QUALITY
//Managing Reliability and Maintainability (R&M)
//quality and reliability
//reliability develop
//reliability training
//以可靠性为中心的维修发展动态
//SAE RCM标准的制订背景
//Software Support Life Cycle Process Evaluation Guide
//测试污染对测试结果的影响
//测试技术要满足工程项目需求
//Audit Report AA 00-341 High Level Architecture
//Audit Report AA 01-128 Integrated System Control
//Audit Report AA 01-23 Simulation High Level Architecture
//Managing Reliability and Maintainability
//Guidance on in-Service Reliability and Maintainability (R&M)
//Intraoperability and Interoperability of Marine Corps Tactical C4I Systems
//AF Instruction 33-133 Joint Technical Architecture -- Air Force
//Promulgation of DOD Policy For Assessment, Test, and Evaluation of Information Technology System Interoperability
//Compatibility, Interoperability, and Integration of Command, Control, Communications, and Computer (C4) Systems
//Design Interface
//Life Cycle Logistics Support and Materiel Fielding Process Technical Manual
//Life Cycle Logistics Support and Materiel Fielding Process Technical Manual2
//概率-物理方法——可靠性研究的新技术
//环境应力筛选有关问题的探讨

  FMEA
//01_fmea_example
//failure analysis of semiconductor devices
//FMEA1
//FMEA Analysis Guidelines
//潜在失效模式及后果分析
//TOOLS OF RELIABILITY ANALYSIS -- Introduction and FMEAs
//FMEA2
//FMEA3
//FMEA失效模式和效果分析
//how to selling_root_cause to management
//Philips FMEA
//Potential Failure Mode and Effects Analysis
//Random-Failure-Models
/ROOT CAUSE ANALYSIS
//root causea nalysis chapter1
//SURFACE VEHICLE RECOMMENDED PRACTICE
//WHAT MAKES A ROOT CAUSE FAILURE ANALYSIS PROGRAM SUCCESSFUL
//故障模式影响分析
//如何進行失效模式與影響分析



  ESD
//Digital Phosphor Oscilloscopes
//A Safety Standard for Electrosensitive Protective Equipment
//Adding Value through Accredited Testing
//Littelfuse Cable Protectors for High Current Applications
//CMOS集成电路的ESD设计技术
//computer ESD solution
//Fundamentals of Electrostatic Discharge An Introduction to ESD
//ESD Suppression Technologies
//ESD Suppression Technologies ec622a ec622a
//Selecting an ESD Suppressor
//ESD Protection Audio Input and Output Lines
//Capacitance and Signal Integrity
//ESD Protection Digital Visual Interface Data Lines
//ESD Protection IEEE 1394 Data Lines
//ESD Protection USB 1.1 Data Lines
//ESD Protection USB 2.0 Data Lines
//ESD Protection Video Input and Output Lines
//General Purpose ESD Protection
//ESD Journal - The ESD & Electrostatics Magazine
//ESD protect
//ESD Standards
//Evaluation of Materials for Cleanliness and ESD Protective Properties
//Electrostatic Discharge (ESD) in Magnetic Recording Past, Present and Future
//Explosions and ESD
//From Electrostatics to ESD
//Fuse fact
//Ground planes for low cost boards
//Grounding Strategies for Printed Circuit Boards
//How Is Static Electricity Generated
//Is Static Electricity Static
//Littelfuse Resistors for Voltage Suppression
//SiVa ESD Demo
//The Competitive Advantage of Standards
//The Evolution of Guide into ISO 17025
//What It Means to ESD

  HALT
//ENVIRONMENTAL EFFECTS
//笔记本电脑失效模式分析表
//测试前笔记本性能测试
//测试前后的机构电性功能验证
//常见失效模式一览表
//可靠性验证测试
//失效分析是指研究产品潜在的或显在的失效机理
//失效效应危害度一览表
//ENVIRONMENTAL ENGINEERING CONSIDERATIONS AND LABORATORY TESTS
//A fundamental overview of accelerated-testing analytic models
//A5 P-FMEA
//accelerated and classical reliability methods integrated
//accelerated model
//accelerated test reference1
//accelerated test reference2
//accelerated test reference3
//accelerated test reference4
//美国可靠性强化试验技术发展点评
//An approach to designing accelerated life-testing experiments
//Ast
//BCC-4V Halt Test
//Critical Analysis Team Report on Accelerated Waste Retrieval Final Design and Fixed Price Contracting
//Don’t Let the Cost of HALT Stop You
//电子设备的可靠性设计技术
//FEMMA Technology Overview FEMMA Technology Overview
/fixturing China presentation 2-04
//FMEA5
//HALT & HASS1
//HALT GUIDELINE 2004
//HALT Guideline
//HALT HASS SEMINAR PRESENTED BY ENVIROTRONICS
//The Application of HALT for Increased Product Reliability
//加速试验综述
//HALT&HASS基础篇 - 中文 - 2003
//HALT-HASS
//HALT-Testing With a Different Purpose
//Hass and Halt
//HASS of Products With Very Low Failure Rates
//high reliability challenge of broadband equipment
//Highly Accelerated Life Testing
//紧凑型节能灯寿命的常规试验方法
//Material failure mechanisms and damage models
//MTBF Assurance test
//PCB relia design
//Quick guide Accelerated Life Testing Data Analysis Basics
//quick guide life data analysis
//可靠性设计
//Reliability Glossary
//reliability prediction VS HALT testing
//Searching for appropriate humidity accelerated migration reliability tests methods
//System reliability modeling considering the dependence of component environmental influences
//understanding accelerated life testing analysis
//what is HAST testing
//why HALT cannot produce a meaningful MTBF number and why this should not be concern
//高加速寿命试验(HALT)与高加速应力筛选(HASS)
//失效率
//用高压锅做测试

//统计知识
//概率与统计入门
研究.
//Pipe Wall Thickness Decisions Using Weibull Analysis
//Weibull analysis for production data
//Weibull Analysis of Production Data
//方差分析(1)
//方差分析(2)
//概率统计
//高级基本统计
//质量管理中的技术统计

pcb
//BGA技术与质量控制
//Creep of Pb of Pb-free Solders free Solders
//intel glossary
//High Speed Board Design
//LEAD-FREE MANDATE PLUMBS NEW DESIGN CHALLENGES
//印制电路板设计原则和抗干扰措施
//PCB化学镀镍金工艺介绍
//SMT technology
//电子工业的丝网印刷
//电子装联焊接技术现状与课题
//混合信号电路板的设计准则
//局部焊接的应用
//无铅焊料的开发与应用
//新手上路认识PCB
//印制电路板的可靠性设计措施
//印制电路工艺创新探讨

CD4

//ATMEL可靠性报告
/MICROCHIP的可靠性报告
//Software Fault Tolerance
//高加速寿命试验(HALT)与高加速应力筛选(HASS)
//论加速试验
//HDBK-HALT-HASS
//LeCroy数字示波器操作手册
//MTBF
//thermal module design
//散热设计准则
//Vedio & Sound Technology
//振动测试概论
//Vibration Technology
//振动技术简介
//An Overview of Vehicle Pass-by Noise
//Time Domain Acoustical Holography and Its Applications
//Key Steps and Methods in the Development of Low Noise Engines
//Squeak and Rattle –State of the Art and Beyond
//Changing the Effective Mass to Control Resonance Problems
//Torsional Resonance Analysis in Air Handling Units
//Understanding the Physics of Electrodynamic Shaker Performance
//An Overview of Vehicle Pass-by Noise
//Newtonian Physics
//Conservation Laws
//Electricity and Magnetism
//Building Vibration Can Contaminate Clean Factories, Cleanrooms And Clean Activitie
//cots vibration testing
//Do We Know What We Are Doing
//Drop Tests vs Shock Table Transportation Tests
//Dynamic design
//Experimental Modal Analysis
//LASER ALIGNMENT SPECIFICATION FOR NEW AND REBUILT MACHINERY, EQUIPMENT AND COMPONENTS
//GENERAL MOTORS CORPORATION VIBRATION STANDARD
//Going To Witness A Vibration Test
//Going To Witness A Vibration Test
//Guidelines for Jury Evaluations of Automotive Sounds
//King Design Test Specification 1.2
//Mechanical Waves
//Newtonian Physics
//FedEx Package_Testing_Procedures
//PSD pattern 及 total Grms 值的計算
//Refraction of Sound Waves
//Rotational_Shock
//shock test system
//Squeak and Rattle –State of the Art and Beyond
//The Dynamic Vibration Absorber
//The Politics of Accelerated stress testing
//Time Domain Acoustical Holography and Its Applications
//Torsional Resonance Analysis in Air Handling Units
//Understanding the Physics of Electrodynamic Shaker Performance
//vibration test detail
//Vibration
//Vibrations and Wave
//包装设计基础
//包装试验
//多轴振动环境试验技术
//海军制造筛选程序
//可靠性振动基础
//中高量级冲击试验技术
//weibull的有关问题(共30份)
//BGA可靠性表征项目:温度循环试验
/ESD损伤实例
//半导体分立器件的可靠性设计
//半导体集成电路的可靠性设计
//半导体器件失效原因分析
//当代质量观与可靠性
//电气继电器(第20部分保护系统)
//电容器的可靠性设计
//电子元器件的防静电应用
//电子元器件的防浪涌应用
//电子元器件的防噪声应用
//电子元器件的抗辐射应用
//电子元器件的可靠性安装
//电子元器件的选择和应用
//电子元器件的质量与可靠性军用标准体系
//电子元器件电路布局的可靠性设计
//电子元器件控制
//电阻器的使用问题
//电阻器与电位器的可靠性
//方案阶段
//非气密性激光模块的高加速寿命试验
//概述
//硅可控整流器(SCR)的使用问题
//化学物理电源的可靠性设计
//环境加速试验的条件
//基本概念二
//基本概念三
//基本概念四
//基本概念五
//基本概念一
//计算机辅助可靠性评价技术
//可靠性工程技术现状2001年报告
//可靠性工作主要内容
//可靠性技术讲座(下)
//可靠性筛选
//微电路的型号命名和采购
//微电路的选用原则
//微电路的质量、可靠性等级
//微电路降额设计指南
//预防ESD损伤的措施
//元器件优选目录编制要求
//35 MAINTENANCE AUDITS
//FAILURES AND ERRORS
//A Metric for Focusing Reliability Efforts
//AN OVERVIEW OF WEIBULL Chpt1
//ASTM_testing
//Availability and Reliability
//Ball-Bearing-Data-by-Lieblein-and-Zelan
//basic of oil analysis
//business centered maintenance
//Project Management Professional Certification Handbook 03-2002
//Changing_your_organization_for_better1
//Changing_your_organization_for_better2
//Changing_your_organization_for_better3
//Changing_your_organization_for_better4
//Changing_your_organization_for_better5
//Cost Of Unreliability
//Cost_Effective_Calibration
//定义必要的可靠性
//Distribution & Logistics Strategy
//Establishing a sense of urgency
//执行测试
//Heat Exchanger IRIS Wall Thickness And Gumbel Smallest Distribution
//How To Justify Equipment Improvements Using
//Integrated Service Technology
//Key_Performance_Indicators
//manufacturing and business excellence
//maximizing_maintenance_profits
//micro reliability and lifetime estimation
//Moving from a Repair focused to a Reliability focused Culture
//Moving from a Repair-focused to a Reliability-focused Culture
//MTBF for notebook
//notebook test Plan
//OCE
//Predict Future Failures From Your Maintenance Records
//REDUCING THE COST OF PREVENTIVE MAINTENANCE
//reliability glossary
//Reliability STD
//Reliabilty and dependability standards are described
//ROHS E文版
//ROHS中文版
//Comparison of Reliability-Availability Mission Simulators
//Small Sample Size Datasets Help or Hindrance
//Solder Data Practice Guide
//SONY STANDARD SS-00259 中英文版
//VIII. STANDARDS AND QUALITY CERTIFICATION FOR QUALITY SYSTEMS,SAFETY, ANDRELIABILITY OF SEMICONDUCTOR DEVICES
//statistical investigation of fatigue life of deep-groove ball bearings
//UK Defence Standardization
//WEEE中文版
//電子產品制造防靜電測試規范
//美国可靠性工程试题集
//威布尔分布寿命分析
//芯片验证测试及失效分析

CD5
MIL-HDBK-17 1F,2F,3F,4F,5F
MIL-STD-883 E,Notice1,2,3,4,5
MIL-STD-461 E,CROSSREFRENCE
MIL-STD-750D Notice1,2,3,4,5
MIL-STD-1246 C,1,2,3,4,5
MIL-HDBK-5 (H,NOTICE)
MIL-STD-810

Number Revision Date Title
MIL-B-5085 B 10/64 Bonding for Aerospace Systems
MIL-HDBK-5H - 12/98 Metallic Materials and Elements(The original issue is 20 MB; Notice 1 is 42MB
Notice 1 10/02
MIL-HDBK-17 Composite Materials Handbook
        Volume 1 F 06/02 Polymer Matrix/Guidelines for Characterization
        Volume 2 F 06/02 Polymer Matrix/Materials Propoerties
        Volume 3 F 06/02 Polymer Matrix/Materials Usage, Design and Analysis
        Volume 4 F 06/02 Metal Matrix Composites
        Volume 5 - 06/02 Ceramic Matrix Composites
MIL-HDBK-340 Notice 1 10/94 Application Guidelines for MIL-STD-1540
MIL-HDBK-343 - 02/86 Design, Construction, and Test Requirements forOne-of-a-Kind Spacecraft
MIL-M-38510 J 11/91 Military Specification, Microcircuits
MIL-PRF-13830 B 01/97 Optical Component Inspection
MIL-PRF-19500 M 10/99 Performance Specification, Semiconductor Devices
QML-19500 22 05/04            Qualified Manufacturers List
MIL-PRF-31032 - 11/95 Printed Circuit Board, General Spec.
MIL-PRF-38534 E 01/03 Performance Specification, Hybrid Circuits
QML-38534 48 03/04             Qualified Manufacturers List
MIL-PRF-38535 F 12/02 Performance Specification, Integrated Circuits
QML-38535 17 07/03             Qualified Manufacturers List
MIL-STD-202 G 02/02 Test Method Standad, Electronic Parts
MIL-STD-461 E 08/99 Control of Electromagnetic Interference
        Draft = 06/99 461 Draft in MSWord Format
        Cross Reference = 03/01 Comparison of 461E with other standards
MIL-STD-750 D 02/95 Test Method, Semiconductor Devices
Notice 1 05/95
Notice 2 02/96
Notice 3 02/00
Notice 4 04/01
Notice 5 11/02
MIL-STD-810 F 08/02 Test Method Standard/Env. Eng. Tests
MIL-STD-883 E 12/96 Test Method Standard/Microcircuits
Notice 1 12/97
Notice 2 08/98
Notice 3 11/99
Notice 4 12/00
Notice 5 03/03
MIL-STD-1246 C 04/94 Cleanliness Levels
Notice 1 05/94
Notice 2 12/94
Notice 3 06/98
Notice 4 02/02
MIL-STD-1540 E-Draft 12/02 Test Requirements for Launch & Space Vehicles(restricted access)
MIL-STD-1553 B 09/76 Multiplex Data Bus
Notice 1 02/80
Notice 2 09/86
Notice 3 01/93
Notice 4 01/96

CD6
REPORT # TITLE DATE NOTES
MIL-HDBK-1512 ELECTROEXPLOSIVE SUBSYSTEMS, ELECTRICALLY INITIATED, DESIGN REQUIREMENTS AND TEST METHODS 9/30/1997
MIL-HDBK-1857 GROUNDING, BONDING AND SHIELDING DESIGN PRACTICES 3/27/1998
MIL-HDBK-235-1B ELECTROMAGNETIC (RADIATED) ENVIRONMENT CONSIDERATIONS FOR DESIGN AND PROCUREMENT OF ELECTRICAL AND ELECTRONIC EQUIPMENT, SUBSYSTEMS AND SYSTEMS 5/1/1993
MIL-HDBK-235-1B(1) ELECTROMAGNETIC (RADIATED) ENVIRONMENT CONSIDERATIONS FOR DESIGN AND PROCUREMENT OF ELECTRICAL AND ELECTRONIC EQUIPMENT, SUBSYSTEMS AND SYSTEMS 12/22/2000 Notice of Validation
MIL-HDBK-237C ELECTROMAGNETIC ENVIRONMENTAL EFFECTS AND SPECTRUM CERTIFICATION GUIDANCE FOR THE ACQUISITION PROCESS 7/17/2001
MIL-HDBK-240 HAZARDS OF ELECTROMAGNETIC RADIATION TO ORDNANCE (HERO) TEST GUIDE 11/1/2002
MIL-HDBK-263B ELECTROSTATIC DISCHARGE CONTROL HANDBOOK FOR PROTECTION OF ELECTRICAL AND ELECTRONIC PARTS, ASSEMBLIES, AND EQUIPMENT (EXCLUDING ELECTRICALLY INITIATED EXPLOSIVE DEVICES) (METRIC) 7/31/1994
MIL-HDBK-274 ELECTRICAL GROUNDING FOR AIRCRAFT SAFETY 11/1/1983
MIL-HDBK-274(1) ELECTRICAL GROUNDING FOR AIRCRAFT SAFETY 6/29/1990 Change Notice 1
MIL-HDBK-293 ELECTRONIC COUNTER-COUNTERMEASURES CONSIDERATIONS IN RADAR SYSTEMS ACQUISITION 6/5/1987
MIL-HDBK-294 ELECTRONIC COUNTER-COUNTERMEASURES CONSIDERATIONS IN NAVAL COMMUNICATION SYSTEMS 12/31/1986
MIL-HDBK-335 MANAGEMENT AND DESIGN GUIDANCE ELECTROMAGNETIC RADIATION HARDNESS FOR AIR LAUNCHED ORDNANCE SYSTEMS 1/15/1981
MIL-HDBK-335(2) MANAGEMENT AND DESIGN GUIDANCE ELECTROMAGNETIC RADIATION HARDNESS FOR AIR LAUNCHED ORDNANCE SYSTEMS 12/28/1992 Notice of Validation
MIL-HDBK-419A GROUNDING, BONDING, AND SHIELDING FOR ELECTRONIC EQUIPMENTS AND FACILITIES 12/29/1987
MIL-HDBK-454A GENERAL GUIDELINES FOR ELECTRONIC EQUIPMENT 11/3/2000

REPORT # TITLE DATE
DI-EMCS-80199B Electromagnetic Interference Control Procedures (EMICP) 8/20/1990
DI-EMCS-80200B Electromagnetic Interference Test Report (EMITR) 8/20/1990
DI-EMCS-80201B Electromagnetic Interference Test Procedures (EMITP) 8/20/1990
DI-EMCS-81295 Electromagnetic Verification Procedures (EMEVP) 11/25/1992
DI-EMCS-81528 Electromagnetic Compatibility Program Procedures 11/14/1996
DI-EMCS-81540 Electromagnetic Environmental Effects (E3) Integration and Analysis Report (E3IAR) 12/19/2002
DI-EMCS-81541A Electromagnetic Environmental Effects (E3) Verification Procedures (E3VP) 12/19/2002
DI-EMCS-81542A Electromagnetic Environmental Effects (E3) Verification Report (E3VR) 12/19/2002
DI-MISC-81113 Radar Spectrum Management (RSM) Test Plan 12/8/1990
DI-MISC-81114 Radar Spectrum Management (RSM) Control Plan 12/5/1990
DI-RELI-80669A Electrostatic Discharge (ESD) Control Program 8/28/1992
DI-RELI-80670A Reporting Results of Electrostatic Discharge (ESD) Sensitivity Tests of Electrical and Electronic Parts Assemblies and Equipment 8/28/1992
DI-RELI-80671A Handling Procedures for Electrostatic Discharge (ESD) Sensitive 8/28/1992